Intraspec at MiNaPAD 2026 in Grenoble, Sharing a Booth with Lumetis
Intraspec Technologies is participating in MiNaPAD 2026, the European semiconductor forum dedicated to packaging, assembly, and microsystem reliability, taking place in Grenoble on June 3–4. We will be welcoming visitors at Booth 31, shared with Lumetis.
Failure Analysis and Reliability, from Component to System
Over the two-day event, Intraspec will showcase its expertise in failure analysis and reliability, covering applications from semiconductor components through to complete systems:
- Fault localization and analysis
- Qualification and incoming inspection
- X-ray tomography and electron microscopy
These techniques are applicable to integrated circuits, electronic boards, passive and discrete components, as well as optical components.
A Shared Booth with Lumetis and the Metiscope
Booth 31 is shared with Lumetis, which will be demonstrating the Metiscope, its multimodal optical inspection system. The combination of our complementary approaches highlights a seamless workflow from sample inspection to the expert investigation carried out by Intraspec.
Meet Us at MiNaPAD
The Intraspec team will be present at Booth 31 throughout the event and available to discuss real-world failure analysis and reliability challenges. We look forward to meeting you in Grenoble on June 3–4, 2026.
