In support of our failure analysis and test techniques of electronic components requiring high-precision sample preparation, Intraspec masters the Allied X-Prep® micro-milling / polishing tool. This tool allows us to operate on both package and bare die thinning with 3D capabilities, providing extreme uniformity in material removal and control of the final thickness, especially for warped substrates. It is coupled to the X-Prep® Vision ™ tool allowing the thickness measurement of silicon or other semi-transparent substrates (precision 0.1 µm).
Backside
die thinning
Sample preparation for light emission and radiation hardness assessment techniques
PCB-mounted
device grinding
Package opening and die thinning on PCB
Mapping of die
remaining thickness
Representation of 3D map of thinned die surface
See below to find our other techniques
