New Solution for Opening Plastic-Encapsulated Components

In our qualification, failure analysis and radiation testing activities, clean access to the die is often a critical step.

Therefore, we have implemented a high-precision laser decapsulation system that significantly improves the quality and reliability of plastic package openings.

🔍 Our current capabilities:

  • A combined process of laser pre-opening followed by a chemical treatment, ensuring a near-100% success rate for gold, aluminium or silver bondings.
  • A fully laser-based protocol dedicated to copper bondings, with similarly excellent results.

📈 These performances represent a clear improvement over the methods used until now, which often showed limitations in precision or repeatability for certain materials.

This process is now fully operational in our lab.

📩 Looking forward to discuss your specific decapsulation or inspection needs.