The quality of the assembly process has direct consequences on electronic components performances, and affects their lifetime. At Intraspec we can perform a set of assembly tests in order to evaluate their quality.

Intraspec Technologies - Nos moyens - Test d'assemblage - processus d'assemblage

ADVANTAGES

Our laboratory can provide you with the following tests:

·Package leak detection

·Bonding wires and die attach solidity (wire pull, ball/die shear)

·Presence of particles inside the package (PIND)

·Solderability

·Voids rate in solder joints measurement

Control of packages

impermeability

Intraspec Technologies - Nos moyens - Test d'assemblage - contrôle des boitiers

Fine leaks,
Gross leaks

Mobile particles

detection

Intraspec Technologies - Nos moyens - Test d'assemblage - détection de particules mobiles

PIND test
(Particle Impact Noise Detection)

3 types

of tests

Intraspec Technologies - Nos moyens - Test d'assemblage - types de tests

Wire Pull, Ball Shear and Die Shear

Look up for our other techniques

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