FIB (Focused Ions Beam) is an etching system extremely fine with a precision of the magnitude of ten nanometers. At Intraspec, we dispose of two different systems with relatively identical working principles, but with different ions sources: the “classical” FIB, using gallium ions, and the Plasma-FIB, using Xenon plasma. In both cases, ions impact on the sample surface at very high speed, milling matter from the targeted area. Milling speed is 20 times higher in a P-FIB, allowing for bigger section areas. Standard FIB can, under specific conditions, have higher resolution.
Several operations can be performed using these two complementary systems: TEM lamellas production, material depositions, circuit editing, microsectioning. It is also possible to perform a set of microsections, with a step of approximately 10-15nm, to obtain a 3D reconstruction of the analysed area using information gathered through the chosen technique (SE, BSE, EDS, EBSD).

Intraspec Technologies - Nos moyens - Focused Ion Beam - Mesure d'épaisseur matériaux

ADVANTAGES

Precision milling at nanometer scale

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Precision microsections on sensitive samples

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TEM lamellas production

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3D reconstruction of sample properties

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Delayering

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Ultimate thinning

TEM

Lamellas production

Intraspec Technologies - Nos moyens - Focused Ion Beam - Création de la lame TEM

TEM lamellas production for Transmission Electron Microscope observations

Materials thickness

Measurement

Intraspec Technologies - Nos moyens - Focused Ion Beam - Mesure d'épaisseur matériaux

Verification of depositions thicknesses by the measurements on the tens of nanometers scale.

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