From reliability tests, down to layers thickness measurements, as well as short circuits localization, different analyses and characterizations can be performed using our tools.
Our IPC certified specialists will be able to perform the whole set of analyses which will be needed to verify the conformity of your electronic assemblies to the standards.
Layer finish thickness
Thicknesses verification using FIB cross sectioning and SEM observation.
Electrical characterization and defect localization using Magnetic Microscopy/Lock-in Thermography
Temperature cycling test to verify the reliability resistance of interconnections.
Voids observation inside the solders by X-Rays observation or X-Ray Computed Tomography.