From reliability tests, to layer thickness measurements, as well as short circuit localization, different analyses and characterizations can be performed using our tools.
Our IPC certified specialists will be able to perform the whole set of analyses which will be needed to verify the conformity of your electronic assemblies with the standards.
Layer finish thickness
measurement
Thickness verification using FIB cross sectioning and SEM observation.
Interconnect defect
Localization
Caractérisation électriques et localisation par Microscopie Electrical characterization and defect localization using Magnetic Microscopy/Lock-in Thermography
Temperature
Cycling
Temperature cycling test to verify the reliability resistance of interconnections.
Voids ratio
quantification
Voids observation inside the solders by X-Ray observation or X-Ray Computed Tomography.
See below to find our analysis techniques
