From reliability tests, to layer thickness measurements, as well as short circuit localization, different analyses and characterizations can be performed using our tools.
Our IPC certified specialists will be able to perform the whole set of analyses which will be needed to verify the conformity of your electronic assemblies with the standards.
![](/wp-content/uploads/2020/06/intraspec-nos-technologies-pcb-et-assemblages-gallery-coupe-brasure.png)
Layer finish thickness
measurement
![](/wp-content/uploads/2020/06/intraspec-nos-technologies-pcb-et-assemblages-mesure-depaisseur-des-couches-de-finition.jpg)
Thickness verification using FIB cross sectioning and SEM observation.
Interconnect defect
Localization
![](/wp-content/uploads/2020/06/intraspec-nos-technologies-pcb-et-assemblages-localisation-de-defaut.jpg)
Caractérisation électriques et localisation par Microscopie Electrical characterization and defect localization using Magnetic Microscopy/Lock-in Thermography
Temperature
Cycling
![](/wp-content/uploads/2020/06/intraspec-nos-technologies-pcb-et-assemblages-variation-rapide-de-temperature-vrt.jpg)
Temperature cycling test to verify the reliability resistance of interconnections.
Voids ratio
quantification
![](/wp-content/uploads/2020/06/intraspec-nos-technologies-pcb-et-assemblages-quantification-de-taux-de-void.jpg)
Voids observation inside the solders by X-Ray observation or X-Ray Computed Tomography.