From reliability tests, to layer thickness measurements, as well as short circuit localization, different analyses and characterizations can be performed using our tools.
Our IPC certified specialists will be able to perform the whole set of analyses which will be needed to verify the conformity of your electronic assemblies with the standards.
Layer finish thickness
Thickness verification using FIB cross sectioning and SEM observation.
Electrical characterization and defect localization using Magnetic Microscopy/Lock-in Thermography
Temperature cycling test to verify the reliability resistance of interconnections.
Voids observation inside the solders by X-Ray observation or X-Ray Computed Tomography.