From reliability tests, to layer thickness measurements, as well as short circuit localization, different analyses and characterizations can be performed using our tools.

Our IPC certified specialists will be able to perform the whole set of analyses which will be needed to verify the conformity of your electronic assemblies with the standards.

Intraspec - Nos technologies PCB et assemblages gallery coupe brasure

Layer finish thickness

measurement

Intraspec - Nos technologies PCB et assemblages - mesure d'épaisseur des couches de finition

Thickness verification using FIB cross sectioning and SEM observation.

Interconnect defect

Localization

Intraspec - Nos technologies PCB et assemblages - localisation de défaut

Electrical characterization and defect localization using Magnetic Microscopy/Lock-in Thermography

Temperature

Cycling

Intraspec - Nos technologies PCB et assemblages - variation rapide de temperature VRT

Temperature cycling test to verify the reliability resistance of interconnections.

Voids ratio

quantification

Intraspec - Nos technologies PCB et assemblages - quantification de taux de void

Voids observation inside the solders by X-Ray observation or X-Ray Computed Tomography.

Pertinent techniques

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