X-Ray Imaging and Computed Tomography is a contactless imaging technique used to observe internal structures of electronic components and systems.
The 3D volume is built by the software from a set of 2D x-rays images acquired at different angles of the sample. Once the volume reconstruction is performed, several post-treatment possibilities open up to analyse the virtual sample. For example, a virtual cross section can be performed following any given direction. A number of different grayscale images can also be produced, allowing an easier differentiation of the sample materials.
Defect location verification
Virtual cross section
Non-destructive analysis of the internal structure of the sample
Solder voids analysis
Assembly level short circuit on an electronic component
Voids in a microprocessor solder BGAs