Sample preparation is a critical step for the failure analysis process, and can often condition its result. We dispose of equipments allowing the depackaging, the cross sectioning, polishing and thinning of all types of components.

Intraspec Technologies - Nos moyens - Préparation d'échantillons - SN158314

ADVANTAGES

Optimization depending on the analysis

·

Decapsulation using different techniques:

chemical, polishing, micro-grinding

Cross section on

optoelectronic

component

Intraspec Technologies - Nos moyens - Préparation d'échantillons - gmr scan PCB

Depackaging and backside thinning

of a Silicon component

on TSOP32 package

Intraspec Technologies - Nos moyens - Préparation d'échantillons - composant silicum

Metallographic

Cross section

on a PCB

Intraspec Technologies - Nos moyens - Préparation d'échantillons - coupe métallographique

Look up for our other techniques

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