In support of our failure analysis and test techniques of electronic components requiring high-precision sample preparation, Intraspec masters the Allied X-Prep® micro-milling / polishing tool. This tool allows us to operate on both package and bare die thinning with 3D capabilities, providing extreme uniformity in material removal and control of the final thickness, especially for warped substrates. It is coupled to the X-Prep® Vision ™ tool allowing the thickness measurement of silicon or other semi-transparent substrates (precision 0.1 µm).

Intraspec Technologies - Sevices - Analyse de défaillance - Amincissement Composants - x-prep

AVANTAGES

Possibility of metal and plastic packages decapsulation

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Can work on single component or assembled on PCB

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Very uniform thinning of substrates (backside)

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Precise verification of remaining thickness

Backside

die thinning

Intraspec Technologies - Sevices - Analyse de défaillance - Amincissement Composants - Amincissement face arriere

Sample preparation for light emission and radiation hardness assessment techniques

PCB-mounted

device grinding

Intraspec Technologies - Sevices - Analyse de défaillance - Amincissement Composants - Fraisage carte

Package opening and die thinning on PCB

Mapping of die

remaining thickness

Intraspec Technologies - Sevices - Analyse de défaillance - Amincissement Composants - Cartographie epaisseurs

Representation of 3D map of thinned die surface

See below to find our other techniques

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