For obviour sanitary reasons our laboratory is temporarily closed. Nevertheless, Intraspec’s team is fully operational and keeps offering you expertise in failure analysis, qualification and
Intraspec will expose at the “Forum de l’électronique”, the tradeshow dedicated to French electronics industry. It will take place in Grenoble, between the 11th and
The european conference on reliability and failure analysis of electronic compoents (ESREF) will come to Toulouse this year, between the 23rd and the 26th of
Intraspec collaborates on SuperCam project, by analysing the laser stack used as the optical pumping source on LISB instrument. The complete article is available on
Intraspec can has now at its disposal an Allied X-Prep® milling/grinding/polishing machine supporting our electrical and physical failure analysis techniques and other applications requiring high precision sample
Intraspec expose at Enova Nantes tradeshow on the 30th and 31st of May, 2019.Come to meet us to discuss about your reliability problems, your analyses,
Intraspec expose at Enova Toulouse tradeshow on the 30th and 31st of May, 2018.Come to meet us to discuss about your reliability problems, your analyses,
As every year since 2010, Intraspec Technologies will be present this year at the workshop organized by the French association for Failure Analysis of Electronic
For obviour sanitary reasons our laboratory is temporarily closed. Nevertheless, Intraspec’s team is fully operational and keeps offering you expertise in failure analysis, qualification and
Intraspec will expose at the “Forum de l’électronique”, the tradeshow dedicated to French electronics industry. It will take place in Grenoble, between the 11th and
The european conference on reliability and failure analysis of electronic compoents (ESREF) will come to Toulouse this year, between the 23rd and the 26th of
Intraspec exposes at Paris Enova tradeshow on the 23rd and the 24th of October, 2018.Come and meet us to discuss about our latest failure analysis
Intraspec collaborates on SuperCam project, by analysing the laser stack used as the optical pumping source on LISB instrument. The complete article is available on
Intraspec can has now at its disposal an Allied X-Prep® milling/grinding/polishing machine supporting our electrical and physical failure analysis techniques and other applications requiring high precision sample
As every year since 2010, Intraspec Technologies will be present this year at the workshop organized by the French association for Failure Analysis of Electronic
Intraspec Technologies
