• Intraspec joins Cap’tronic
    A positive step in sharing electronic know-how and benefiting from Cap’tronic network resources !
  • Best wishes for 2022!
    Our Intraspec team wishes you a wonderful new year !
  • COVID19 crisis: What about lab work?
    For obviour sanitary reasons our laboratory is temporarily closed. Nevertheless, Intraspec’s team is fully operational and keeps offering you expertise in failure analysis, qualification and
  • Forum de l’électronique 2020 – Grenoble
    Intraspec will expose at the “Forum de l’électronique”, the tradeshow dedicated to French electronics industry. It will take place in Grenoble, between the 11th and
  • ESREF 2019
    The european conference on reliability and failure analysis of electronic compoents (ESREF) will come to Toulouse this year, between the 23rd and the 26th of
  • Enova Paris 2018
    Intraspec exposes at Paris Enova tradeshow on the 23rd and the 24th of October, 2018.Come and meet us to discuss about our latest failure analysis
  • Intraspec goes to Mars!
    Intraspec collaborates on SuperCam project, by analysing the laser stack used as the optical pumping source on LISB instrument. The complete article is available on
  • New thinning techniques available
    Intraspec can has now at its disposal an Allied X-Prep® milling/grinding/polishing machine supporting our electrical and physical failure analysis techniques and other applications requiring high precision sample
  • Enova Nantes 2019
    Intraspec expose at Enova Nantes tradeshow on the 30th and 31st of May, 2019.Come to meet us to discuss about your reliability problems, your analyses,