Laser techniques use a confocal microscopy platform with a laser source for the lighting and scanning of the sample area. It is possible in this way to image the die at high resolution through the silicon backside. Thanks to the interaction between the integrated circuit and the laser beam, it is possible to gather information on the component’s internal activity. Stimulation techniques: OBIRCh, OBIC, TLS, DLS, XVM Probing techniques: EOFM (LVI), EOP (LVP)