New thinning techniques available

Intraspec can has now at its disposal an Allied X-Prep® milling/grinding/polishing machine supporting our electrical and physical failure analysis techniques and other applications requiring high precision sample preparation. This tool allows us to operate both at package and die levels with 3D deprocessing capabilities, ensuring extreme uniformity in material removal and final thickness control, especially for warped substrates. It is coupled with the X-Prep® Vision™ tool for thickness measurement of silicon or of other semi-transparent substrates (precision 0.1µm).
Applications: sample preparation for light emission techniques / access to failure area for SEM analysis / radiation hardness assessment techniques.