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  • About us
  • Your technologies
    • Integrated circuits
    • PCB and assemblies
    • Passives and discretes
    • Optoelectronic components
  • Our techniques
    • Electrical and electro-optical characterisations
    • Focused Ion Beam
    • Light emission microscopy
    • Electron microscopy
    • Magnetic Microscopy
    • Optical Microscopy
    • Sample preparation
    • Die Thinning
    • X-Ray Imaging and Computed Tomography
    • Time Domain Reflectometry
    • SEE sensitivity
    • Laser techniques
    • Assembly test
    • Lock-in Thermography
    • Accelerated ageing
  • Our services
    • Failure analysis
    • Entry Control
    • Reliability
    • Qualification
    • Space EMC derisking
  • Tools sales
  • R&D
  • News
  • Contact us
  • Français

News

  • Intraspec at the 20th ANADEF Workshop – Seignosse-Hossegor, June 20262026 June 9
    From June 8 to 12, 2026, Intraspec Technologies is participating in the 20th ANADEF Workshop, held at the Belambra Club in Seignosse-Hossegor (Landes, France). ANADEF
  • MiNaPAD 2026: Intraspec and Lumetis in Grenoble2026 June 3
    Intraspec at MiNaPAD 2026 in Grenoble, Sharing a Booth with Lumetis Intraspec Technologies is participating in MiNaPAD 2026, the European semiconductor forum dedicated to packaging,
  • Intraspec Receives ISO 9001 Certification2026 May 20
    Intraspec is proud to announce that it has officially obtained the ISO 9001 certification (Management system certified ISO9001:2015 by Bureau Veritas – Certificate n° FR101616),
  • More information on the Opening of Plastic-Packaged electronics components2025 November 26
    In addition to our previous article on the decapsulation of plastic-packaged electronic components with gold, silver, or aluminum bonding wires, we present hereafter a few
  • New Solution for Opening Plastic-Encapsulated Components2025 July 22
    In our qualification, failure analysis and radiation testing activities, clean access to the die is often a critical step. Therefore, we have implemented a high-precision
  • Intraspec participated in the CERBUS mission of a balloon flight over the Atlantic2024 July 11
    Open Stratospheric Balloons are popular at CNES, and for the first time, one of these ballons has crossed the Atlantic between Sweden and Canada. On
  • Toulouse is the reliability place to be this October !2023 September 19
    ESREF 2023, the essential conference on reliability and failure analysis of electronic components, opens its doors in just two weeks in Toulouse. The perfect opportunity
  • Intraspec joins the prestigious Galaxie Club2023 February 17
    Inter-company opportunities can be expected ! For more information on Galaxie Club : Club Galaxie – Les acteurs du spatial en Occitanie (club-galaxie.com)
  • Best wishes for 20232023 January 2

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Intraspec technologies

20, Avenue Didier Daurat 31400 Toulouse, France

 

Phone: +33 (0)9 72 42 24 74
Fax: +33 (0)5 61 27 47 32

 

contact@intraspec.com

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