In addition to our previous article on the decapsulation of plastic-packaged electronic components with gold, silver, or aluminum bonding wires, we present hereafter a few
In our qualification, failure analysis and radiation testing activities, clean access to the die is often a critical step. Therefore, we have implemented a high-precision
ESREF 2023, the essential conference on reliability and failure analysis of electronic components, opens its doors in just two weeks in Toulouse. The perfect opportunity
Inter-company opportunities can be expected ! For more information on Galaxie Club : Club Galaxie – Les acteurs du spatial en Occitanie (club-galaxie.com)
For its activities in failure analysis, defect localisation, reliability,assessment of electronic, opto-electronic and optical components. It’s time to contact them !