Category: News

From June 8 to 12, 2026, Intraspec Technologies is participating in the 20th ANADEF Workshop, held at the Belambra Club in Seignosse-Hossegor (Landes, France).

ANADEF — the National Association for Failure Analysis — has, for nearly forty years, brought together France’s leading industrial and academic laboratories specializing in failure analysis of electronic components and assemblies. This biennial workshop is recognized as the benchmark event for the field in France, featuring technical tutorials, case-study sharing sessions, and focused workshops addressing open challenges faced by laboratories.

The 20th edition is centered on imaging and materials analysis techniques, defect localization and characterization, and component reliability issues — all key areas of expertise and activity for Intraspec.

Our participation in this workshop reflects our ongoing commitment to technical monitoring and engagement with the failure analysis community: comparing methodologies, keeping pace with evolving investigation practices, and contributing to the collective discussions that help shape the future of the industry.

Intraspec at MiNaPAD 2026 in Grenoble, Sharing a Booth with Lumetis

Intraspec Technologies is participating in MiNaPAD 2026, the European semiconductor forum dedicated to packaging, assembly, and microsystem reliability, taking place in Grenoble on June 3–4. We will be welcoming visitors at Booth 31, shared with Lumetis.

Failure Analysis and Reliability, from Component to System

Over the two-day event, Intraspec will showcase its expertise in failure analysis and reliability, covering applications from semiconductor components through to complete systems:

  • Fault localization and analysis
  • Qualification and incoming inspection
  • X-ray tomography and electron microscopy

These techniques are applicable to integrated circuits, electronic boards, passive and discrete components, as well as optical components.

A Shared Booth with Lumetis and the Metiscope

Booth 31 is shared with Lumetis, which will be demonstrating the Metiscope, its multimodal optical inspection system. The combination of our complementary approaches highlights a seamless workflow from sample inspection to the expert investigation carried out by Intraspec.

Meet Us at MiNaPAD

The Intraspec team will be present at Booth 31 throughout the event and available to discuss real-world failure analysis and reliability challenges. We look forward to meeting you in Grenoble on June 3–4, 2026.

Intraspec is proud to announce that it has officially obtained the ISO 9001 certification (Management system certified ISO9001:2015 by Bureau Veritas – Certificate n° FR101616), an internationally recognized standard that demonstrates the company’s commitment to quality management and customer satisfaction.

This certification highlights the continuous efforts of our teams to improve processes, ensure high-quality services, and strengthen the trust of our clients and partners. An important milestone that confirms our dedication to excellence and continuous improvement.

In addition to our previous article on the decapsulation of plastic-packaged electronic components with gold, silver, or aluminum bonding wires, we present hereafter a few examples of decapsulation on devices bonded with copper.


To preserve the integrity of the copper wires, we use a photochemical decapsulation process: the combined action of a specific solvent and a UV laser attacks the plastic package in the targeted area. This decapsulation process is slower than the conventional methods used for gold bondings, and some package residues may occasionally remain after the operation.

In return, it offers a near-certainty of opening without risk to the copper wires, which is essential for failure analysis and reliability assessment of electronic components.

The photos above illustrate some of the results obtained on a plastic-encapsulated component with copper wire bonding.

In our qualification, failure analysis and radiation testing activities, clean access to the die is often a critical step.

Therefore, we have implemented a high-precision laser decapsulation system that significantly improves the quality and reliability of plastic package openings.

🔍 Our current capabilities:

  • A combined process of laser pre-opening followed by a chemical treatment, ensuring a near-100% success rate for gold, aluminium or silver bondings.
  • A fully laser-based protocol dedicated to copper bondings, with similarly excellent results.

📈 These performances represent a clear improvement over the methods used until now, which often showed limitations in precision or repeatability for certain materials.

This process is now fully operational in our lab.

📩 Looking forward to discuss your specific decapsulation or inspection needs.

Credits : CNES/PRODIGIMA/GABORIAUD Romain, 2024

Open Stratospheric Balloons are popular at CNES, and for the first time, one of these ballons has crossed the Atlantic between Sweden and Canada.

On June 26, 2024, after 3 days and 17 hours of flight, one balloon from the Transat mission reached its destination with the CERBUS mission on board, a scientific experiment orchestrated by CNES and developed by Intraspec.

This mission allowed molecules from space contaminants, deposited on specific substrates, to be exposed to solar flux throughout the flight. Following the recovery of the experiment, the study of these samples should enable the evaluation of the impact of radiation, especially UV, on these molecules and provide a better understanding of the physico-chemical evolution of these contaminants.

ESREF 2023, the essential conference on reliability and failure analysis of electronic components, opens its doors in just two weeks in Toulouse.

The perfect opportunity to come and meet us on our stand and exchange with our technical experts!

Inter-company opportunities can be expected !

Intraspec, Group Rhea and Sotrem SEO gathered at Cité de l’Espace when joining the club

For more information on Galaxie Club : Club Galaxie – Les acteurs du spatial en Occitanie (club-galaxie.com)

For its activities in failure analysis, defect localisation, reliability,
assessment of electronic, opto-electronic and optical components.
It’s time to contact them !