A positive step in sharing electronic know-how and benefiting from Cap’tronic network resources !
Category: News
For obviour sanitary reasons our laboratory is temporarily closed. Nevertheless, Intraspec’s team is fully operational and keeps offering you expertise in failure analysis, qualification and reliability.
Please do not hesitate to contact us if you want to:
- Learn more about specific techniques (like cathodomuminescence, Passive Voltage Contrast using FIB, Magnetic Microscopy, etc.). We will be more than happy to explain it to you more in detail.
- Increase your expertise on your recurrent problems.
- Discover what Intraspec’s team can offer (in normal conditions).
Intraspec will expose at the “Forum de l’électronique”, the tradeshow dedicated to French electronics industry. It will take place in Grenoble, between the 11th and the 13th of February. Come and meet us on our booth! Forum de l’électronique
The european conference on reliability and failure analysis of electronic compoents (ESREF) will come to Toulouse this year, between the 23rd and the 26th of September. Intraspec will be there with a booth: come and meet ingeneers to discuss about our activities!
Intraspec exposes at Paris Enova tradeshow on the 23rd and the 24th of October, 2018.
Come and meet us to discuss about our latest failure analysis techniques for electronic components we can provide you!
Intraspec collaborates on SuperCam project, by analysing the laser stack used as the optical pumping source on LISB instrument. The complete article is available on the following link:
Intraspec can has now at its disposal an Allied X-Prep® milling/grinding/polishing machine supporting our electrical and physical failure analysis techniques and other applications requiring high precision sample preparation. This tool allows us to operate both at package and die levels with 3D deprocessing capabilities, ensuring extreme uniformity in material removal and final thickness control, especially for warped substrates. It is coupled with the X-Prep® Vision™ tool for thickness measurement of silicon or of other semi-transparent substrates (precision 0.1µm).
Applications: sample preparation for light emission techniques / access to failure area for SEM analysis / radiation hardness assessment techniques.
Intraspec expose at Enova Nantes tradeshow on the 30th and 31st of May, 2019.
Come to meet us to discuss about your reliability problems, your analyses, your qualifications. You will discover a wide range of services Intraspec provides to its customers!
Intraspec expose at Enova Toulouse tradeshow on the 30th and 31st of May, 2018.
Come to meet us to discuss about your reliability problems, your analyses, your qualifications. You will discover a wide range of services Intraspec provides to its customers!
